Separation type metallurgical reduction method and apparatus thereof

ABSTRACT

A separation type metallurgical reduction method and an apparatus thereof. The separation type metallurgical reduction apparatus includes a reduction furnace and a multistage cooling device. By means of the separation type metallurgical reduction apparatus, the metallurgical reduction/smelting process and the cooling process are separately performed in different spaces at the same time to improve the operation of the conventional metallurgical reduction furnace within which the smelting process and the cooling process are totally limitedly performed. Accordingly, the shortcomings of too long waiting time, waste of great amount of energy and low yield rate that exist in the conventional metallurgical reduction furnace can be eliminated.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to a separation typemetallurgical reduction method and an apparatus thereof. By means of theseparation type metallurgical reduction apparatus, the metallurgicalreduction/smelting process and the cooling process are separatelyperformed in different spaces at the same time. In contrast, in aconvent ional metallurgical reduction furnace, the smelting process andthe cooling process must be performed in the same space and it isnecessary to repeatedly raise and lower the temperature of the reductionfurnace. Accordingly, by means of the separation type metallurgicalreduction apparatus of the present invention, the operation time of themetallurgical process is greatly shortened to overcome the shortcomingof too long waiting time that exists in the conventional metallurgicalreduction furnace. Moreover, by means of the separation typemetallurgical reduction apparatus of the present invention, the energyconsumption is greatly reduced and the yield rate is greatly increased.

2. Description of the Related Art

It is known that the developments of all kinds of industries have reliedon sufficient supply and full application of specific materials for solong, especially some metal materials. Therefore, the metallurgicaltechnique plays an important role in the advance of human society. Themost important material used in the current electronic industries issilicon (Si). The sale of silicon-made components is about 95% of thesale of the semiconductor components in the world. In natural field, allsilicon materials exist not in element state. Instead, the siliconmaterials exist in form of silica (impure SiO₂) and silicate. Therefore,it is an important tropic in science and technology how to effectivelyand economically smelt silicon material from the natural raw materialfor manufacturing all kinds of silicon-made products.

In the above materials, metallurgical-grade Si (MG-Si) is a material ofsolar cell. The metallurgical-grade Si can be divided into three majorvarieties, that is, monocrystalline silicon, multicrystalline siliconand non-crystalline silicon. The raw material from whichmulticrystalline silicon or monocrystalline silicon is smelted is mainlyhigh-purity (>97%) quartz sand, which is also a crystal of SiO₂. Thefirst step of manufacturing high-purity multicrystalline silicon isreducing silicon from silica. In a common manufacturing process, thematerials of silica, coke, coal and woods are mixed and placed in agraphite electrical arc heating reduction furnace and heated at a hightemperature of 1500° C.˜2000° C. to reduce SiO₂ into silicon. Thechemical reaction formulas are follows:

SiO₂+C→Si+CO₂

SiO₂+2C→Si+2CO

In the conventional reduction technique, after the silica is placed intothe reduction furnace, it is necessary to gradually raise thetemperature of the reduction furnace from an ambient temperature to thehigh temperature of 1500° C.˜2000° C. for melting and reducing thematerial to be reduced. After the reduction process is completed, it isnecessary to gradually lower the temperature of the reduction furnace toabout 250° C. (approximate to the ambient temperature) for taking outthe reduction product and avoiding abrupt temperature change, which mayill affect the equipment, the quality of the reduction product and theoperation environment. After the reduction product is taken out from thereduction furnace, another crop of material to be reduced is placed intothe reduction furnace. Then, it is necessary to gradually re-raise thetemperature of the reduction furnace from the ambient temperature to thehigh temperature of 1500° C.˜2000° C. for melting and reducing thematerial. In the above process, it is necessary to repeatedly raise andlower the temperature of the reduction furnace. This is because in thecase that the reduction furnace is opened under the high temperature of1500° C.˜2000° C., there is a danger of explosion of the furnace bodydue to excessively great difference between the temperature of thefurnace body and the temperature of the environment. Moreover, a greatamount of high-temperature fluid will enter the operation environment tocause thermal contamination of the operation environment and injury tosite workers. What is more, the abrupt temperature drop may lead tostructural damage to the high-temperature smelted silicon product. Also,the silicon product will be inevitably contaminated with impurities inthe environment and become useless.

According to practical estimation, one single cycle of the conventionalmetallurgical reduction of the silicon material (fillingmaterial→heating→reducing→lowering temperature→releasing product) willcost a quite long time of about 32 hours.

Moreover, after the temperature of the reduction furnace is continuouslyraised from about 250° C. to 1500° C.˜2000° C. for smelting the materialand then gradually lowered to about 250° C. for taking out the reductionproduct, a great amount of thermal energy is lost and wasted.Furthermore, when re-raising the temperature of the reduction furnacefrom 250° C. to 1500° C.˜2000° C. for reduction, a great amount ofelectrical energy is consumed. Therefore, in the conventionalmetallurgical reduction method, a very long waiting time is wasted andthe environment is contaminated. Also, a great amount of energy iswasted. This is not economic and fails to meet the requirement ofenvironmental protection.

It is therefore tried by the applicant to provide a novel metallurgicalreduction method and an apparatus thereof. By means of the separationtype metallurgical reduction apparatus, the operation time of themetallurgical process is greatly shortened and the energy consumption isgreatly reduced and the yield rate is greatly increased.

SUMMARY OF THE INVENTION

It is therefore a primary object of the present invention to provide aseparation type metallurgical reduction method and an apparatus thereof.The separation type metallurgical reduction apparatus includes areduction furnace and a multistage cooling device in cooperation withthe reduction furnace. By means of the separation type metallurgicalreduction apparatus, the reduction/smelting process of the material andthe cooling process of the reduction product are separately performed indifferent spaces at the same time. Accordingly, the waiting time forre-rise of the temperature of the reduction furnace is greatly shortenedso that the operation time of the metallurgical process is greatlyshortened. Also, the energy consumption in each operation is greatlyreduced in accordance with the requirement of environmental protect ion.Therefore, the production efficiency is greatly promoted and the yieldrate is greatly increased.

To achieve the above and other objects, the separation typemetallurgical reduction apparatus of the present invention includes areduction furnace and a multistage cooling device. The reduction furnaceserves to provide a high temperature for melting and reducing a materialplaced in the reduction furnace. The cooling device is connected withthe reduction furnace in alignment with a material release passagethereof. The reduction product is released from the material releasepassage into the cooling device for cooling. Accordingly, thereduction/smelting process of the material and the cooling process ofthe reduction product are separately performed in different spaces atthe same time. The cooling device includes a load chamber arranged underthe reduction furnace. The material release passage is positionedbetween the load chamber and the reduction furnace. The internal spaceof the load chamber communicates with the internal space of thereduction furnace through the material release passage. A materialrelease gate is disposed in the material release passage for controllingunblocking/blocking of the material release passage. In addition, apreheating chamber is arranged on one side of the load chamber incommunication with the load chamber. A first load gate is disposedbetween the load chamber and the preheating chamber to controlcommunication/non-communication between the preheating chamber and theload chamber. The preheating chamber is provided with a carrier inputgate through which the carrier device can be input from outer side. Acooling chamber is installed on the other side of the load chamber incommunication with the load chamber. A second load gate is disposedbetween the cooling chamber and the load chamber to controlcommunication/non-communication between the cooling chamber and the loadchamber. The cooling chamber is provided with a carrier output gatethrough which the carrier device can be moved out of the coolingchamber. In addition, a continuous conveying device is arranged in apath extending from outer side of the carrier input gate through thecarrier input gate, the preheating chamber, the first load gate, theload chamber, the second load gate, the cooling chamber and the carrieroutput gate to the outer side of the cooling chamber. The conveyingdevice serves to convey the carrier device through the path to carry thereduction product for the preheating and cooling processes stage bystage.

A material dropping device is disposed above the reduction furnace. Amaterial dropping passage is positioned between the material droppingdevice and the reduction furnace, whereby the internal space of thematerial dropping device communicates with the internal space of thereduction furnace through the material dropping passage. A materialdropping gate is arranged in the material dropping passage forcontrolling unblocking/blocking of the material dropping passage. Thematerial to be reduced is filled in the internal space of the materialdropping device. When the material dropping gate of the materialdropping passage is opened to unblock the material dropping passage, thematerial to be reduced is allowed to drop into the reduction furnacethrough the material dropping passage.

According to the above arrangement, the reduction/smelting process ofthe material and the cooling process of the reduction product areseparately performed in different spaces at the same time. Accordingly,the metallurgical reduction process and cooling process can beoverlapped and performed at the same time crop by crop to shorten timeinterval between reduction processes of two crops of material to bereduced. Therefore, the production efficiency is promoted and the yieldrate is increased. Moreover, the cooling device is separated from thereduction furnace and the carrier device is separately conveyed throughthe cooling device section by section so that the quality of thereduction product can be ensured. Also, the energy consumption isgreatly reduced in accordance with the requirement of environmentalprotection.

The present invention can be best understood through the followingdescription and accompanying drawings, wherein:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a front view of a preferred embodiment of the separation typemetallurgical reduction apparatus of the present invention:

FIG. 2 is a side view of the preferred embodiment of the separation typemetallurgical reduction apparatus of the present invention;

FIG. 3 is a front view according to FIG. 1, showing that the material tobe reduced is filled into the material dropping device:

FIG. 4 is a front view according to FIG. 1, showing that the material tobe reduced is dropped from the material dropping device into thereduction furnace:

FIG. 5 is a front view according to FIG. 1, showing that the material isheated, molten and reduced in the reduction furnace;

FIG. 6 is a front view according to FIG. 1, showing that the preheatedcarrier device is conveyed to the load chamber;

FIG. 7A is a front view according to FIG. 1, showing that the reductionproduct is dropped from the reduction furnace into the load chamber;

FIG. 7B is a side view according to FIG. 7A, showing that the reductionproduct is dropped from the reduction furnace into the load chamber;

FIG. 8 is a front view according to FIG. 1, showing that the reductionproduct is completely released from the reduction furnace and thereduction furnace is re-filled with another crop of material to bereduced and the carrier device with the reduction product is ready to beconveyed into the cooling chamber;

FIG. 9 is a front view according to FIG. 1, showing that the carrierdevice with the reduction product is conveyed into the cooling chamberfor cooling and a vacant carrier device is conveyed into the preheatingchamber for preheating; and

FIG. 10 is a front view according to FIG. 1, showing that the cooledcarrier device with the cooled reduction product is conveyed out of thecooling chamber.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Please refer to FIGS. 1 and 2. According to a preferred embodiment, theseparation type metallurgical reduction apparatus of the presentinvention includes at least one reduction furnace 10 and a coolingdevice 20.

The reduction furnace 10 has an internal space in which the material tobe reduced is placed (as shown in FIG. 3). In practice, a reduction pot11 is disposed in the reduction furnace 10 for containing the material30 to be reduced. The material 30 to be reduced is molten and reduced inthe reduction furnace 10 at a high temperature of 1500° C.˜2000° C. Thematerial to be reduced can be silicon material such as silica or silicasand, chrome material, tungsten material, magnesium material, ironmaterial, copper material or any other smeltable metal material. Thepresent invention can be used to reduce and smelt any material that canbe molten and reduced at high temperature. A heating device 13 isarranged in the reduction furnace 10 to uniformly heat the internalspace of the reduction furnace 10. The heating device 13 can heat theinternal space in an electrical arc heating manner, high-frequencyheating manner or any other suitable heating manner. A blending device14 is installed in the reduction furnace 10 to extend into the reductionpot 11 and continuously blend the material for the heating device 13 tomore uniformly heat and melt the material 30. In addition, a heatinsulation device 15 (preferably a liquid-cooled or water-cooled heatinsulation device) is disposed between inner wall 101 and outer wall 102of the reduction furnace to prevent the high heat in the reductionfurnace 10 from being conducted to outer side of the reduction furnace10. In this case, the ambient environment of the reduction furnace 10 isprotected from being thermally contaminated. Also, the thermal energycan be recycled for reuse.

A material dropping device 17 is disposed above the reduction furnace10. A material dropping passage 171 is positioned between the materialdropping device 17 and the reduction furnace 10, whereby the internalspace of the material dropping device 17 communicates with the internalspace of the reduction furnace 10 through the material dropping passage171. A material dropping gate 172 is arranged in the material droppingpassage 171 for controlling unblocking/blocking of the material droppingpassage 171. The material to be reduced is filled in the internal spaceof the material dropping device 17. When the material dropping gate 172of the material dropping passage 171 is opened to unblock the materialdropping passage 171, the material 30 to be reduced is allowed to dropinto the reduction furnace 10 (or the reduction pot 11). A materialfilling port 173 is disposed on an upper side of the material droppingdevice 17. An upper cover 174 is disposed at the material filling port173 for blocking/unblocking the material filling port 173 so as toprevent the material 30 from being contaminated by ambient impurities.The material 30 to be reduced can be automatically regularly andquantitatively filled into the material dropping device 17 by means of aconveying belt to save labor and avoid inconvenience.

The cooling device 20 is arranged under a material release passage 16 ofthe reduction furnace 10. The cooling device 20 is provided with a loadchamber 21. The internal space of the reduction furnace and the internalspace of the load chamber 21 communicate with each other through thematerial release passage 16. A material release gate 161 is disposed inthe material release passage 16 for controlling unblocking/blocking ofthe material release passage 16. The material can be previously input toat least one carrier device 40 in the internal space of the load chamber21. The carrier device 40 is aligned with an exit of the materialrelease passage 16 to accept the material output from the materialrelease passage 16.

A preheating chamber 22 is installed on one side of the load chamber 21.A first load gate 221 is disposed between the load chamber 21 and thepreheating chamber 22 to control communication/non-communication betweenthe preheating chamber 22 and the load chamber 21. When the first loadgate 221 is opened, the carrier device 40 can pass through the firstload gate 221 into the load chamber 21. The preheating chamber 22 isfurther provided with a carrier input gate 222 through which the carrierdevice 40 can be input from outer side. In addition, a heating device223 is further disposed in the preheating chamber 22 for heating theinternal space thereof. The preheating chamber 22 mainly serves topreheat the input carrier device 40 and then input the carrier device tothe load chamber 21 before the reduction product is input to the loadchamber 21. This can avoid too large difference between the temperatureof the carrier device 40 and the temperature of the reduction product soas to avoid ill affection on the reduction product or accident in theloading process.

A cooling chamber 23 is installed on the other side of the load chamber21. A second load gate 231 is disposed between the cooling chamber 23and the load chamber 21 to control communication/non-communicationbetween the cooling chamber 23 and the load chamber 21. When the secondload gate 231 is opened, the carrier device 40 can pass through thesecond load gate 231. A cooling fan 232 or the like circulation coolingdevice can be disposed in the cooling chamber 23 to speed the coolingoperation. In addition, the cooling chamber 23 is provided with acarrier output gate 233 through which the cooled reduction product andthe carrier device 40 are conveyed to outer side of the cooling chamber23.

A continuous or multisection conveying device 24 is disposed in thepreheating chamber 22, the load chamber 21 and the cooling chamber 23between the gates thereof for conveying the carrier device 40. By meansof the conveying device 24, the carrier device 40 can be input fromouter side through the carrier input gate 222 to the preheating chamber22. The carrier device 40 then is conveyed through the first load gate221 into the load chamber 21 and then conveyed through the second loadgate 231 into the cooling chamber 23. Finally, the carrier device 40 isconveyed through the carrier output gate 233 to the outer side.Accordingly, the carrier device (or the reduction product) can beconveniently and continuously conveyed. In addition, two carriertransportation trolleys 50 are respectively disposed behind the carrierinput gate 222 of the preheating chamber 22 and in front of the carrieroutput gate 233 of the cooling chamber 23 for inputting the carrierdevice 40 to the conveying device 25 and outputting the carrier device40 from the conveying device 25. Accordingly, the preheating chamber 22,the load chamber 21, the cooling chamber 23 and the conveying devicecooperate with each other to form a separation type multistage coolingdevice, which can continuously convey the carrier device 40.

In addition, heat insulation devices 25 (preferably liquid-cooled orwater-cooled heat insulation devices) are respectively disposed betweeninner walls and outer walls of the separated spaces of the coolingdevice 20 to prevent the high heat in the spaces from being conducted toouter side and protect the ambient environment from being thermallycontaminated. Moreover, the internal spaces of the reduction furnace 10and the cooling device 20 are all clean rooms (or vacuum rooms) to avoidcontamination of the material or the product and ensure stable qualityof operation.

Please now refer to FIGS. 3 to 10. The separation type metallurgicalreduction method of the present invention includes:

step 201 of filling the material 30 to be reduced into the materialdropping device 17 and preparing the material 30;

step 202 of opening the material dropping gate 172 to quantitativelydrop the material 30 to be reduced through the material dropping passage171 into the internal space of the reduction furnace 10 (or thereduction pot 11);

step 203 of closing the material dropping gate 172 and the materialrelease gate 161 to form a closed space in the reduction furnace 10;

step 204 of using the heating device 13 of the reduction furnace 10 toheat the material 30 to a high temperature so as to melt and reduce thematerial 30, in this step, the material 30 in the reduction furnace 10being heated to a high temperature of 1500° C.˜2000° C. and molten, whenheated and molten, a blending device 14 being used to uniformly blendthe material 30 for reducing the material 30 into a reduction product301;

step 205 of using the conveying device 24 to convey the preheatedcarrier device 40 from the preheating chamber 22 into the load chamber21 in a position under the material release passage 16, then the firstand second load gates 221, 231 being closed and then the materialrelease gate 161 being opened to drop the reduction product 301 throughthe material release passage 16 into the carrier device in the loadchamber 21;

step 206 of closing the material release gate 161 and further droppinganother crop of material 30 to be reduced from the material droppingdevice 17 into the reduction furnace 10 for heating and reductionprocess, in the meantime, the second load gate 231 of the cooling device20 being opened to convey the carrier device 40 with the reductionproduct 301 from the load chamber 21 into the cooling chamber 23 forcooling;

step 207 of closing the carrier output gate 233 and simultaneously(later) opening the carrier input gate 222 to convey the carrier device40 from the outer side (the trolley 50) into the preheating chamber 22for preheating:

step 208 of previously conveying the carrier device 40 into the loadchamber 21 before step 205 is performed again; and

step 209 of cooling the reduction product 301 in the cooling chamber 23to a set temperature relatively approximate to ambient temperature andthen opening the carrier output gate 233 to convey the cooled reductionproduct 301 and the carrier device 40 out of the cooling chamber 23. Theset temperature can be under 150° C.˜100° C. according to the currentnormal operation. In steps 206 to 208, a cooling fan 232 or the likecooling device can be used to speed the cooling process of the reductionproduct 301 and the carrier device 40 carrying the reduction product301. The operation is performed in a clean or vacuum room. In addition,an inert gas can be released during the cooling process to keep thereduction product 301 in a stable state to complete the reductionprocess of one crop of material.

According to the aforesaid, the heating/reduction operation of thematerial 30 in the reduction furnace 10 and the cooling operation of thereduction product 301 are performed in different spaces at the sametime. The blocking/unblocking of the material release passage 16 and theopening/closing of the respective gates are effectively controlled tokeep the reduction furnace 10 at a high temperature. It is unnecessaryto repeatedly raise/lower the temperature of the reduction furnace as inthe conventional reduction furnace. Therefore, the energy consumptioncan be greatly reduced. Moreover, the time for each re-rise of thetemperature of the internal space of the reduction furnace to a hightemperature necessary for the reduction operation is greatly shortened.Therefore, the product ion efficiency is greatly promoted. Furthermore,the reduction stage of operation and cooling stage of operation areperformed in separated environments and thus can be independently moreflexibly and conveniently controlled as necessary to ensure high qualityof the reduction product 301.

According to the above arrangement, the present invention has thefollowing advantages:

-   1. By means of the separation type metallurgical reduction method    and the apparatus thereof, the heating/reduction operation of the    material and the cooling operation of the reduction product are    performed in different spaces at the same time. Therefore, the    waiting time for each re-rise of the temperature of the reduction    furnace to the reduction temperature is greatly shortened and the    energy consumption is greatly reduced. Therefore, the product ion    efficiency is greatly promoted and a great amount of energy is    saved.-   2. By means of the separation type metallurgical reduction method    and the apparatus thereof, the steps of dropping material,    reduction, cooling and achieving reduction product can be    integratedly and continuously performed to save the time for    closedown of the furnace, lowering of the temperature, release of    the material, preparation of the material, holdup for lack of    material, restart of the furnace and reheating. Therefore, the yield    rate can be greatly increased.-   3. The present invention includes a unique cooling device connected    with the reduction furnace to independently cool the reduction    product. Therefore, it is unnecessary to repeatedly cool the    reduction furnace for cooling the reduction product. This can reduce    loss of thermal energy in the reduction furnace and save electrical    energy for repeatedly raising the temperature of the reduction    furnace in accordance with the environmental protection requirements    of energy-saving and carbon reduction,-   4. By means of the separation type metallurgical reduction method    and the apparatus thereof, the heating/reduction operation of the    material and the cooling operation of the reduction product are    performed in different spaces at the same time. Therefore, the    reduction product is provided with a better and more stable cooling    environment to minimize the possibility of contamination of the    reduction product by ambient impurities during the cooling process.    Therefore, the reduction stage of operation and the cooling stage of    operation are performed in separated environments and thus can be    independently and more flexibly controlled to ensure high quality of    the reduction product.

The above embodiments are only used to illustrate the present invention,not intended to limit the scope thereof. Many modifications of the aboveembodiments can be made without departing from the spirit of the presentinvention.

1. A separation type metallurgical reduction apparatus comprising: areduction furnace having an internal space, a material dropping passageextending from outer side of the reduction furnace into the internalspace and a material release passage extending from the internal spaceto outer side of the reduction furnace, the internal space serving toreceive a material to be reduced and provide a high temperature, forreducing the material to be reduced; and a cooling device disposed onone side of the reduction furnace and connected with the materialrelease passage that extends into an internal space of the coolingdevice, the material release passage being provided with a materialrelease gate for controlling unblocking/blocking of the material releasepassage.
 2. The separation type metallurgical reduction apparatus asclaimed in claim 1, wherein the cooling device at least includes a loadchamber in which at least one carrier device can be positioned inalignment with the material release passage for accepting a reductionproduct released from the material release passage, the load chamberbeing at least provided with a load gate through which the carrierdevice can be conveyed into the load chamber.
 3. The separation typemetallurgical reduction apparatus as claimed in claim 2, wherein thecooling device further includes a preheating chamber in connection withone of the load gates of the load chamber and in communication with theload chamber through the load gate, whereby the carrier device can passthrough the load gate between the load chamber and the preheatingchamber.
 4. The separation type metallurgical reduction apparatus asclaimed in claim 2, wherein the cooling device further includes acooling chamber in connection with one of the load gates of the loadchamber and in communication with the load chamber through the loadgate, whereby the carrier device can pass through the load gate betweenthe load chamber and the cooling chamber.
 5. The separation typemetallurgical reduction apparatus as claimed in claim 3, wherein thecooling device further includes a cooling chamber in connection with oneof the load gates of the load chamber and in communication with the loadchamber through the load gate, whereby the carrier device can passthrough the load gate between the load chamber and the cooling chamber.6. The separation type metallurgical reduction apparatus as claimed inclaim 1, wherein a material dropping device is disposed above thereduction furnace for receiving the material to be dropped into thereduction furnace and reduced, the material dropping passage beingarranged between the material dropping device and the reduction furnace,the material dropping device having an internal space in communicationwith the internal space of the reduction furnace through the materialdropping passage, a material dropping gate being disposed in thematerial dropping passage for controlling unblocking/blocking of thematerial dropping passage.
 7. The separation type metallurgicalreduction apparatus as claimed in claim 2, wherein a material droppingdevice is disposed above the reduction furnace for receiving thematerial to be dropped into the reduction furnace and reduced, thematerial dropping passage being arranged between the material droppingdevice and the reduction furnace, the material dropping device having aninternal space in communication with the internal space of the reductionfurnace through the material dropping passage, material dropping gatebeing disposed in the material dropping passage for controllingunblocking/blocking of the material dropping passage.
 8. The separationtype metallurgical reduction apparatus as claimed in claim 1, wherein areduction pot is disposed in the reduction furnace for receiving thematerial to be reduced.
 9. The separation type metallurgical reductionapparatus as claimed in claim 2, wherein a reduction pot is disposed inthe reduction furnace for receiving the material to be reduced.
 10. Theseparation type metallurgical reduction apparatus as claimed in claim 6,wherein a reduction pot is disposed in the reduction furnace forreceiving the material to be reduced.
 11. The separation typemetallurgical reduction apparatus as claimed in claim 1, wherein atleast one heating device is disposed in the reduction furnace forheating the internal space of the reduction furnace.
 12. The separationtype metallurgical reduction apparatus as claimed in claim 2, wherein atleast one heating device is disposed in the reduction furnace forheating the internal space of the reduction furnace.
 13. The separationtype metallurgical reduction apparatus as claimed in claim 1, wherein aconveying device is disposed in the cooling device for conveying atleast one carrier device.
 14. The separation type metallurgicalreduction apparatus as claimed in claim 2, wherein a conveying device isdisposed in the cooling device for conveying at least one carrierdevice.
 15. The separation type metallurgical reduction apparatus asclaimed in claim 6, wherein a conveying device is disposed in thecooling device for conveying at least one carrier device.
 16. Theseparation type metallurgical reduction apparatus as claimed in claim 1,wherein the reduction furnace has an inner wall and an outer wall, aheat insulation device being disposed between the inner and outer wallsof the reduction furnace.
 17. The separation type metallurgicalreduction apparatus as claimed in claim 2, wherein the reduction furnacehas an inner wall and an outer wall, a heat insulation device beingdisposed between the inner and outer walls of the reduction furnace. 18.The separation type metallurgical reduction apparatus as claimed inclaim 6, wherein the reduction furnace has an inner wall and an outerwall, a heat insulation device being disposed between the inner andouter walls of the reduction furnace.
 19. The separation typemetallurgical reduction apparatus as claimed in claim 13, wherein thereduction furnace has an inner wall and an outer wall, a heat insulationdevice being disposed between the inner and outer walls of the reductionfurnace.
 20. The separation type metallurgical reduction apparatus asclaimed in claim 1, wherein a cooling fan or a circulation coolingdevice is disposed in the cooling device for speeding cooling process.21. The separation type metallurgical reduction apparatus as claimed inclaim 2, wherein a cooling fan or a circulation cooling device isdisposed in the cooling device for speeding cooling process.
 22. Theseparation type metallurgical reduction apparatus as claimed in claim 6,wherein a cooling fan or a circulation cooling device is disposed in thecooling device for speeding cooling process.
 23. The separation typemetallurgical reduction apparatus as claimed in claim 13, wherein acooling fan or a circulation cooling device is disposed in the coolingdevice for speeding cooling process.
 24. The separation typemetallurgical reduction apparatus as claimed in claim 1, wherein thecooling device has an inner wall and an outer wall a heat insulationdevice being disposed between the inner and outer walls of the coolingdevice.
 25. The separation type metallurgical reduction apparatus asclaimed in claim 2, wherein the cooling device has an inner wall and anouter wall, a heat insulation device being disposed between the innerand outer walls of the cooling device.
 26. The separation typemetallurgical reduction apparatus as claimed in claim 6, wherein thecooling device has an inner wall and an outer wall, a heat insulationdevice being disposed between the inner and outer walls of the coolingdevice.
 27. The separation type metallurgical reduction apparatus asclaimed in claim 13, wherein the cooling device has an inner wall and anouter wall, a heat insulation device being disposed between the innerand outer walls of the cooling device.
 28. A separation typemetallurgical reduction method comprising steps of: (1) dropping amaterial to be reduced into a reduction furnace for reduction; (2)moving a reduction product from the reduction furnace into a closedcooling device, which is separable from the reduction furnace andisolated from outer side; (3) separating the reduction furnace from thecooling device; (4) dropping another crop of material to be reduced intothe reduction furnace for reduction and simultaneously cooling thereduction product in the cooling device; and (5) moving the cooledreduction product out of the cooling device.
 29. The separation typemetallurgical reduction method as claimed in claim 28, wherein in step(1), when reduced, the material in the reduction furnace is blended tospeed reduction process.
 30. The separation type metallurgical reductionmethod as claimed in claim 28, wherein in step (2), the reductionproduct is first moved from the reduction furnace into a load chamberand after the reduction furnace is separated from the cooling device,the reduction product is moved from the load chamber into a coolingchamber for cooling.
 31. The separation type metallurgical reductionmethod as claimed in claim 28, wherein in step (2), the cooling deviceincludes a preheating chamber, a carrier device being conveyed from thepreheating chamber into the load chamber, after the load chamber isclosed and isolated from outer side, the reduction product being movedinto the carrier device in the closed load chamber.
 32. The separationtype metallurgical reduction method as claimed in claim 30, wherein instep (2), the cooling device includes a preheating chamber, a carrierdevice being conveyed from the preheating chamber into the load chamber,after the load chamber is closed and isolated from outer side, thereduction product being moved into the carrier device in the closed loadchamber.
 33. The separation type metallurgical reduction method asclaimed in claim 28, wherein in step (4), a cooling fan or a circulationcooling device is disposed in the cooling device for speeding coolingprocess.
 34. The separation type metallurgical reduction method asclaimed in claim 30, wherein in step (4), a cooling fan or a circulationcooling device is disposed in the cooling device for speeding coolingprocess.
 35. The separation type metallurgical reduction method asclaimed in claim 28, wherein in step (4), an inert gas is released intothe cooling device to keep the reduction product in a stable state. 36.The separation type metallurgical reduction method as claimed in claim30, wherein in step (4), an inert gas is released into the coolingdevice to keep the reduction product in a stable state.
 37. Theseparation type metallurgical reduction method as claimed in claim 31,wherein in step (4), an inert gas is released into the cooling device tokeep the reduction product in a stable state.
 38. The separation typemetallurgical reduction method as claimed in claim 28, wherein at leastone of steps (1) to (4) is performed in a clean or vacuum condition. 39.The separation type metallurgical reduction method as claimed in claim31, wherein the step of moving the reduction product from the reductionfurnace into the carrier device in the closed load chamber is performedin a clean or vacuum condition.
 40. The separation type metallurgicalreduction method as claimed in claim 35, wherein the steps are performedin a clean or vacuum condition.